Low Melting Point Thermal Adhesives

No heat sink preheating required
Low thermal resistance
The Low Melting Point Thermal of TIC™800P Series
is low melting point thermal interface material. At 50°C, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800P Series
shows no thermal performance degradation after 1,000
hours@130°C,or
after 500 cycles, from -25°C to 125°C.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features
1.0.024°C-in² /W thermal resistance
2.Naturally tacky at room temperature, no adhesive required
3.No heat sink preheating required

Applications
1.High Frequency Microprocessors
2.Notebook and Desktop PCs
3.Computer Serves
4.Memory Modules
5.Cache Chips
6.IGBT