Polyamide hot-melt adhesive

100% polyamide resin.Good adhesiveness,Good high and low temperature resistance,Good oil resistance
Product Composition:
·
100% polyamide resin.
Features:
·
Good adhesiveness, adheres to most surfaces with high bonding strength.
·Good high and low temperature resistance, and have excellent thermal stability
·Good oil –resistance and good electric insulation
·Have lower viscosity at melting condition
·100% solid, no pollution and toxicity.
·Specially formulated for low pressure molding
Specifications:
·Appearance Amber pellet
·Melting point 170~185°C
·Melting viscosity(mPa.s/210oC) 1000~7000
·Glass transition temperature(°C) ≤-30
·Elongation at break(%) ≥500

Operation:

·KW180 hot melt adhesive is easy to use, and has short setting time.It is suitable to most of application machine. Application temperature is 200~240°C.
Packing:
·Packed in 20kg or 25kg plastic bag with woven package.
Storage:
·KW180 hot melt adhesive is stable for one year if stored in a dry and ventilated place at room temperature, and kept away from light.
Update Date:2011-8-10 1:41:52