Polyamide Hot Melt Adhesive for Low-Pressure Injection Forming

Polyamide Hot Melt Adhesive for Low-Pressure Injection Forming
1. UL 94V-0 grade standard
2. good heat resistance 150 degree
Polyamide Hot Melt Adhesive for Low Pressure Injection Forming

Application Scopes:
* Automobiles: heat resistant glue stick/ wire fixing/ component bonding/ fiber bonding
* Electronics / Electrical Industry: UL94V0 Halogen-free hot melt glue stick/ electronic components fixing/ planar and jumper cable fixing/ filling
* Low-pressure injection forming: sealing, cable, cell phone battery, connector, which has very good performance at electronic insulation and humidity and dust resistance.


Part number: H-SW9870

Base
synthetic resin
Solid content
100%
Shape
stick, granule
Color
crystal yellow, black
Diameter
11/7mm (length 270/300mm)
Odour
none
Softening Point (°C)
165±5
180°C Viscosity (cps)
8000±2000

7500±2000
Setting Time (sec)
3-8
Toxicity
none
Storage Stability
packaging 1 year minimum.

Attention:
1. Open time is changeable, depending upon the nature of the substrate, application temperature, thickness of adhesive applied, room temperature and closing pressure.
2. Please store the adhesive in well ventilated place. Avoid direct sunlight exposure.