Polyamide Hot Melt Adhesive for shoes making and so on

Polyamide Hot Melt Adhesive
1.good flow performance.
2.Excellent flexility and low viscosity.
3.Strong cohesive force.
HY-208
(hot melt adhesive)

Polyamide Hot melt Adhesive
formed by the high-temperature condensation reaction

of dimer acid and the multi-dimensional amine. It is able to dissolve in general organic solvent. Its melt viscosity has great relationship with the temperature. low viscosity, good flow performance, excellent flexility, and strong cohesive force.
Properties:
1.Good flow performance.
2.Excellent flexility and low viscosity.
3.Strong cohesive force.
Application:
Hot melt adhesive as seal material in electronic components, decoration in automobile.
Hot melt adhesive of shoes, fabric, wood, plastic, metal and ceramic.
Hot melt adhesive of packing material, and so on.
Specification:
Style
HY-208(Hot Melt Adhesive)
Acid Value(mgKOH/g)
≤10
Amine Value(mgKOH/g)
≤8
Viscosity(mpa.s/160)
2000-6000
Softening Point(°C)
100-180
Color(Fe-co)
≤8
Water absorption (%)
≤0.5
Shear strength(mps, AL/AL)
≥4
Peeling strength(N/25mm,PE/PE,60±2°C)
≥100

Packing:
The paper and plastic bag, 25KG/bag.