Sunday, September 4, 2011

Henkel loctite quality 495 cyanoacrylate adhesive

plastic cyanoacrylate adhesive,general purpose, Medium viscosity ,bonding rubber,metal, plastic
HYBOND 495 plastic cyanoacrylate adfhesive

PRODUCT DESCRIPTION
HYBOND 495 is a general purpose cyanoacrylate instant adhesive. Medium viscosity ,bonding rubber,metal and plastics, gap fill up to 0.1mm

PRODUCT CHARACTERISTICS
Technology
Cyanoacrylate

Chemical Type
Ethyl cyanoacrylate
Appearance (uncured)
Transparent colorless liquid

Components
one part-require no mixing

Viscosity,Brookfield-LVF,25°C1
Spindle 1, speed 30 rpm
40-60cps
Cure
Humidity

Application
Bonding

Key bstrates
Metals, plastics and Elastomers

Specific Gravity@25°C:
1.5

TYPICAL CURING PERFORMANCE
Under normal conditions, the atmospheric moisture initiates the curing process. Although full functional strength is developed in a relatively short time, curing continues for at least 24 hours before ful chemical/solvent resistance is developed.

Cure Speed vs. Substrate
The rate of cure will depend on the substrate used. The table below shows the fixture time achieved on different materials at 22 °C / 50 % relative humidity. This is defined as the time to develop shear strength of 0.1 N/mm².
Fixture Time, ISO 4587, seconds:
Mild Steel (degreased)
10 to 30
Aluminum(degreased)
5 to 15
Zinc dichromate
30 to 90
Neoprene
<5
Rubber, nitrile
<5
ABS
10 to 30
PVC
3 to 10
Polycarbonate
20 to 60
Phenolic
5 to 20

Cure Speed vs. Bond Gap
The rate of cure will depend on the bondline gap. Thin bond lines result in high cure speeds, increasing the bond gap will decrease the rate of cure.
Cure Speed vs. Humidity
The rate of cure will depend on the ambient relative humidity. Higher relative humidity levels result in more rapid speed of cure.
Cure Speed vs. Activator
Where cure speed is unacceptably long due to large gaps, applying activator to the surface will improve cure speed. However, it can reduce ultimate strength of the bond effect.

Directions for use:
1. Bond areas should be clean and free from grease. Clean all surfaces with a HYBOND cleaning solvent and allow to be dried.
2. HYBOND Primer may be applied to the bond area. Avoid applying excess Primer. Allow the Primer to dry.
3. HYBOND Activator may be used if necessary. Apply HYBOND Activator to one bond surface (do not apply activator to the primed surface where Primer is also used). Allow the Activator to dry
4. Apply adhesive to one of the bond surfaces (do not apply the adhesive to the activated surface). Do not use items like tissue or a brush to spread the adhesive. Assemble the parts within a few seconds. The parts should be accurately located, as the short fixture time leaves little opportunity for adjustment.
5. HYBOND Activator can be used to cure fillets of product outside the bond area. Spray or drop the activator on the excess product.
6. Bonds should be held fixed or clamped until adhesive has fixtured.
7. Product should be allowed to develop full strength before subjecting to any service loads (typically 24 to 72 hours after assembly, depending on bond gap, materials and ambient conditions).
Storage
Store product in the unopened container in a dry location, storage instruction is shown on the label of bottle

Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than 8 °C can adversely affect product properties.
Material removed from containers may be contaminated during

use. Do not return product to the original container. Heng ying Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or

Customer Service Representative.

Note
The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of person
against any hazards that may be involved in the handling and then use. In light of the foregoing,
HENY YINGl Corporation

specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a

particular purpose, arising from sale or use of HENG YING

Corporation’s products. HENG YING Corporation specifically

disclaims any liability for consequential or incidental

damages of any kind, including lost profits.
The discussion of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any HENG YING Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent

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