-High thermal conductivity.
-High consistency under 200 Centi-degree
-The tube packing is very easy to carry and use.
Parameter
units
condition
Test Method
Test Result
Color
N/A
25
°c
Visual
Golden
Thermal Conductivity
W/m-K
No
ROCT8.140-82
>1.95
Thermal Impedance
°c -in
2/W
25°c
ASTM D1470
<
0.225
Specific Gravity
N/A
25°c
ASTM D1475
>2.3
Evaporation
%
150°c /24Hours
Fed.Std.791
<
0.001
Bleed
%
150°c /24Hours
Fed.Std.792
<
0.05
Moment beared temperatur
°c
N/A
N/A
-50~240°c
Operation Temperture
°c
N/A
N/A
-30~180°c
Effectiveness and USE:
1. Used as a heat transfer medium of electronic components which can enhance
the efficency of the heat conduction.
2. For the better heat conduction between cpu and heatsink and enlong the life of cpu.
3. Filling in gaps when High-power transistors connect with aluminum, copper accessory.
4. Reduce the operate Heat of various of Thermal Dissipation elements to guarantee their
Normal operation.
Breif Introduction of Thermal paste
Thermal pastes Mainly used for Computer CPU, Heatsink, and Electronic and Electrical Appliances Such as Electric Stove, Refrigerator, Water Dispenser, Electric Kettle, etc.), Electrical (switching Power Supply, Relay, Inverter, Thyristor, etc.), Control board, Graphics Card, LCD , Fiber-optic Communications Equipments, LED and other Wide Range of Electrical and Electronic Fields. Our thermal paste all have passed SGS international environmental certification and in line with the EU ROHS testing standards.
This product's storage period is 1 year (25 °C below).
These products are non-dangerous goods, according to general chemical transport.
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