-High thermal conductivity.
-High consistency under 200 Centi-degree
-The tube packing is very easy to carry and use
Thermal compounds specification and element
Specification
Testing items
Unit
Condition
Testing Methods
Result
Color
No
No
Visual
Grey
Thermal Conductivity
W/(m·K)
25°C
ROCT8.140-82
>1.065
Thermal Impedance
°C-m2/W
25°C
ASTM D5470
< 0.215
Specific Gravity
No
25°C
ASTM D1475
> 2.5
Evaporation
%
200°C/24Hours
Fed.Std.791
<0.001
Bleed
%
200°C/24Hours
Fed.Std.791
< 0.05
Dielectric Constant A
No
100Hz
ASTM D150
>5.1
Dissipation Factor A
No
100Hz
ASTM D150
<0.005
Viscosity
CPS
25°C
GB/T-10247
88
Thixotropic Index
mm
25°C
GB/T-269
280±10
Operation Temperature
°C
No
No
-50~240 °C
Element
Silicone Compounds
50%
Carbon Compounds
20%
Metal Oxide Compounds
30%
Packing
ST
SP
TU
CN
DS-380
Color/grey
20g
0.5g
0.5g,1g,30g
10g,1kg
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