Sunday, August 21, 2011

LED module potting sealant

low-Viscosity,has features of thermal cycle resistance, high and low temperature residence, being elastic and stable at -60~200
LED module potting silicone sealant
OPT555W
one-component
silicone pouring sealant
Product features:
OPT555W
is a kind of low-Viscosity,
one-component
silicone potting adhesive, which can be cured in room temperature. It has features of

thermal cycle resistance, high and low temperature residence, being elastic and stable at -60~200°C, UV residence, aging resistance, moisture proof, electrical insulation, anti-seismic, corona-resistance, leakage-resistance. It belongs to liquid deketoxime,

single-component room-temperature-cured
silicone rubber, which is not applicable in copper and PC material adhesive which follows the ROHS order of European Union.
Typical use
1. Moisture-proof and water proof package for electronic element and fittings.
2. Protection layers of insulation material and circuit board.
3. water-proof sealing of Electricity , Telecommunication equipment and range finder for parking.
4. Water—proof package for LED Display lighting module and Pixel.
5. Potting protection for mini electronic element,

module
,
optoelectronics display device and circuit board.
Using method
1. Clean surface: clean and dry and degrease the surface before coating.2. Coating: open the cover then press the adhesive to the clean surface.3. Curing: put the equipment in the open air until it is cured from outside to inside. The adhesive will cure for 2~4mm within 24h in room temperature. It is suggested that it should be spontaneous curing in outdoor for enough long time to ensure the effect. Low temperature requires more time. Sealing adhesive with thickness of 6mm needs more than 7 day to be completely cured.
Note: OPT
two-component product is well recommended for the

potting with
thickness
more than 6mn.
N
ote
Cover the bottle after operation as soon as possible. Clean the bottle mouth if there is some coating. It will do no harm to the product.
Technical parameter before and after curing
performance index
OPT555W
Before curing
appearance
white fluid
viscosity(cps)
5000~8000
relativity density(g/cm
3
)
1.00~1.05
surface drying time(min)
≤40
cured time
(
d
)
3~7
cured type
single-component deketoxime

After
cuing
hardness
(
Shore A
)
25±5
tensile strength(MPa)
≥0.6
shear strength(MPa)
≥0.5
breaking elongation(%)
200~300
applicable temperature
(
°C
)
-60~200
volume resistivity
(
Ω·cm
)
≥5.0×10
16
dielectric strength
(
kV/·mm
)
≥20
dielectric constant
(
1.2MHz
)
2.8
loss factors
(
1.2MHz
)
0.001
The statistics above are tested in 25°C, relative humidity 55% condition, 7 days after curing. Our company is not responsible for the difference which caused by different condition or modified products.
Packaging specification
300ML/bottle, 25bottle/case, 100ML/bottle, 100bottle/case,
45ML/bottle, 200bottle/case

Storage and transport
1. The product should be stored under 35°C in cool, dry condition and the shelf-life can be 9 months under 25°C.
2. These products don’t belong to dangerous goods, so they can be transported as normal chemicals. But be careful of Leakage.
3. Products passed deadline must be confirmed before use.



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