Dow corning quality silicone sealant

OPT5299 is two-component silicone sealant for the addition of heat sealant system, Heat resistance, heat aging resistance
OPT5299 Thermal Flame Retardant

Silicone Sealant
Features
OPT5299 is two-component silicone sealant for the addition of heat sealant system, has the following characteristics:
1, Under the condition of rubber mixture at room temperature storage time is longer, but can be quickly cured under heating conditions, particularly conducive to the use of automated production line.
2, Heat resistance, heat aging resistance. After curing in a wide temperature range (-60 ~ 250 °C) to maintain elasticity, excellent insulation properties
3, The curing process does not shrink, has better water moisture and anti-aging properties.
4, OPT906 flame retardant, flame retardant to UL94-V0 grade.
Typical Use
For a high-power electronic components, require a higher temperature of the cooling and power supply module and circuit board potting protection. Such as module encapsulation, car HID lamp module power supply, automotive ignition system power modules, solar panels, transformers, sensors and so on.
Use Technology
1, Them were placed in two groups matched by weighing the tank mixing evenly mixed.
2, The mixed infusion to be a good potting compound within the device, generally from time to vacuum deaeration, If you need to get high thermal conductivity, the proposed vacuum deaeration reperfusion. Curing at room temperature or heating can be. Rubber curing speed and curing temperature has a lot in the winter take a long time to cure, recommended heat curing method, 80 °C cured 15-30 minutes, room temperature curing will normally take around 8 hours.
Notes
:
1, plastic material should be sealed. Mixture should be a good run out of rubber, to avoid wastage.
2, this product is non-dangerous goods, but not imported and eyes.
3, prolonged storage, the rubber will be settlement of the fill. Please Stir use, does not affect performance.
4, glue contact with these chemicals in 906T will not cure:
1) N, P, S compounds.
2) Sn, Pb, Hg, As and other ionic compounds.
3) with alkynes and a number of vinyl compounds
Technical parameters before and after curing
Performance
OPT 5299B
OPT5299W
OPT 5299T


Before cured
appearance
A: Black liquids
B: White liquids
A: White liquids
B: White liquids
A: Transparent
liquids
B: Transparent liquids
A component viscosity (cps,25°C)
3500~5500
3500~5500
3500~5500
B Component viscosity (cps,25°C)
3500~5500
3500~5500
3500~5500

Operational performance


Two-component mixing ratio
(weight ratio)A:B
1:1
1:1
1:1
After mixing(cps)
3500~5500
3500~5500
3500~5500
Operating time(min,25°C)
80
80
80
Cure time(25degree) (min,25°C)
480
480
480
Cure time (80degree)(min,80°C)
20
20
20


After
cured

Hardness (
shore A
)
60-68
60-68
60-68
Thermal conductivity coefficient
[
(m·K)
]
≥0.85
≥0.85
≥0.85
Dielectric strength(kV/mm)
≥27
≥27
≥27
Dielectric strength (1.2MHz)
3.0~3.3
3.0~3.3
3.0~3.3
Volume resistivity(Ω·cm)
≥1.0×10
16
≥1.0×10
16
≥1.0×10
16
Linear expansion coefficient
[
m/(m·K)
]
≤2.2×10
-4
≤2.2×10
-4
≤2.2×10
-4
Linear expansion coefficient
[
m/(m·K)
]
3.0~3.3
3.0~3.3
3.0~3.3
Resistance to burning
≥1.0×10
16
≥1.0×10
16
≥1.0×10
16